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Inventor profile of:

Tomoko Kato

City:

Ichihara

Country:

Japan

Published Applications:

Last publication date:

2019-11-14

Top Assignees for applications by Tomoko Kato

The entities that hold a legal rights for patent applications filed by inventor Kato Tomoko:

DOW CORNING TORAY COMPANY, LTD. 7 Chiyoda-ku, Tokyo, Japan
DOW CORNING TORAY CO., LTD. 5 Tokyo, Japan
DOW CORNING TORAY CO., LTD. 3 Chiyoda-ku, Tokyo, Japan
Dow Corning Toray Company, Ltd. 1 Chyoda-ku, Tokyo, Japan
DOW CORNING TORAY COMPANY, LTD. 1 Tokyo, Japan
DOW CORNING CORPORATION 1 MIDLAND, MI United States
DOW TORAY CO., LTD. 1 Tokyo, Japan

Recent patent applications by Kato Tomoko

Tomoko Kato from Ichihara, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2019-11-14

US20190345291A1

Chemistry; metallurgy

Thermally conductive silicone compound

#2 | 2013-05-30

US20130137613A1

Chemistry; metallurgy

Thermally conductive silicone grease composition

#3 | 2011-09-22

US20110227235A1

Electricity

Curable organopolysiloxane composition, optical semiconductor element sealant, and optical semiconductor device

#4 | 2011-08-04

US20110188213A1

Chemistry; metallurgy

Thermally conductive silicone composition and electronic device

#5 | 2011-06-16

US20110143025A1

Chemistry; metallurgy

Method of manufacturing a layered silicone composite material

#6 | 2011-03-24

US20110071266A1

Chemistry; metallurgy

Curable organopolysiloxane composition, method of curing thereof, semiconductor device, and adhesion promotor

#7 | 2011-02-17

US20110039738A1

Chemistry; metallurgy

Thermally conductive silicone grease composition

#8 | 2010-12-02

US20100301377A1

Electricity

Curable organopolysiloxane composition and semiconductor device

#9 | 2010-11-04

US20100276721A1

Chemistry; metallurgy

Light emitting device encapsulated with silicones and curable silicone compositions for preparing the silicones

#10 | 2010-08-26

US20100213623A1

Performing operations; transporting

Method of manufacturing a semiconductor device and a semiconductor device produced thereby

#11 | 2010-06-10

US20100140537A1

Chemistry; metallurgy

Curable silicone composition

#12 | 2010-03-11

US20100063185A1

Electricity

Curable silicone composition and electronic component

#13 | 2009-12-03

US20090294796A1

Chemistry; metallurgy

Adhesion-promoting agent, curable organopolysiloxane composition, and semiconductor device

#14 | 2009-08-13

US20090203837A1

Chemistry; metallurgy

Curable silicone composition and electronic components

#15 | 2008-10-23

US20080262158A1

Chemistry; metallurgy

Curable organopolysiloxane composition, method of curing thereof, semiconductor device, and adhesion promoter

InventorID:

6038312 ⎘