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Inventor profile of:

Junshi Soeda

City:

Osaka

Country:

Japan

Published Applications:

4

Last publication date:

2026-05-21

Top Assignees for applications by Junshi Soeda

The entities that hold a legal rights for patent applications filed by inventor Soeda Junshi:

TEIJIN LIMITED 3 Osaka, Japan
TEIJIN LIMITED 1 Osaka-shi, Japan
TEIJIN LIMITED 1 Osaka-shi, Osaka, Japan
HAMAMATSU PHOTONICS K.K. 1 Hamamatsu, Japan
HAMAMATSU PHOTONICS K.K. 1 Hamamatsu-shi, Japan

Recent patent applications by Soeda Junshi

Junshi Soeda from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-05-21

US20260143582A1

MULTILAYER BODY AND METHOD FOR PRODUCING SAME

#2 | 2023-11-02

US20230347636A1

Performing operations; transporting

POLYMER MEMBER/INORGANIC BASE COMPOSITE, PRODUCTION METHOD THEREFOR, AND POLYMER MEMBER THEREFOR

#3 | 2020-04-02

US20200103557A1

Optical element for terahertz waves and manufacturing method of the same

#4 | 2020-04-02

US20200101675A1

Performing operations; transporting

Composite of thermally-modified polymer layer and inorganic substrate, composite of polymer member and inorganic substrate, and production methods thereof

InventorID:

6038580 ⎘