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Inventor profile of:

Ching-Hung Wang

City:

Hsinchu

Country:

Taiwan

Published Applications:

Last publication date:

2024-06-06

Top Assignees for applications by Ching-Hung Wang

The entities that hold a legal rights for patent applications filed by inventor Wang Ching-Hung:

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 7 Hsinchu, Taiwan
MACRONIX INTERNATIONAL CO., LTD. 4 Hsinchu, Taiwan
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 1 Hsin-Chu, Taiwan

Recent patent applications by Wang Ching-Hung

Ching-Hung Wang from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-06-06

US20240186258A1

Electricity

Photolithography alignment process for bonded wafers

#2 | 2023-11-23

US20230378125A1

Electricity

SEMICONDUCTOR BONDING TOOL AND METHOD OF OPERATING THE SAME

#3 | 2023-09-07

US20230282612A1

Electricity

MECHANICAL WAFER ALIGNMENT DETECTION FOR BONDING PROCESS

#4 | 2023-06-15

US20230187359A1

Electricity

Memory device

#5 | 2023-03-02

US20230066893A1

Electricity

Mechanical wafer alignment detection for bonding process

#6 | 2022-10-13

US20220328419A1

Electricity

Photolithography alignment process for bonded wafers

#7 | 2022-06-02

US20220173040A1

Electricity

Memory device and method of manufacturing the same

#8 | 2021-12-02

US20210375781A1

Electricity

Photolithography alignment process for bonded wafers

#9 | 2020-07-16

US20200227298A1

Electricity

Method for alignment, process tool and method for wafer-level alignment

#10 | 2019-12-26

US20190393067A1

Electricity

Method for alignment, process tool and method for wafer-level alignment

#11 | 2017-08-29

US15374515

Electricity

Non-volatile semiconductor memory

#12 | 2014-09-18

US20140264545A1

Electricity

Semiconductor element having conductive damascene structures extending perpendicular to doping strips, and manufacturing method of the same

InventorID:

6044926 ⎘