Sanda
Japan
9
2023-12-21
The entities that hold a legal rights for patent applications filed by inventor Dojima Daichi:
Daichi Dojima from Sanda, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
EVALUATION METHOD FOR SILICON CARBIDE SUBSTRATES
#2 | 2023-09-28METHOD FOR MANUFACTURING ALUMINUM NITRIDE SUBSTRATE, ALUMINUM NITRIDE SUBSTRATE, AND METHOD FOR FORMING ALUMINUM NITRIDE LAYER
#3 | 2023-07-06ALUMINUM NITRIDE SUBSTRATE MANUFACTURING METHOD, ALUMINUM NITRIDE SUBSTRATE, AND METHOD OF REMOVING STRAIN LAYER INTRODUCED INTO ALUMINUM NITRIDE SUBSTRATE BY LASER PROCESSING
#4 | 2023-06-29METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR SUBSTRATE, AND METHOD FOR PREVENTING CRACK OCCURRENCE IN GROWTH LAYER
#5 | 2023-06-22Silicon carbide substrate manufacturing method, silicon carbide substrate, and method of removing strain layer introduced into silicon carbide substrate by laser processing
#6 | 2023-06-22METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR SUBSTRATE, AND METHOD FOR FORMING GROWN LAYER
#7 | 2023-06-01MANUFACTURING METHOD OF MODIFIED ALUMINUM NITRIDE RAW MATERIAL, MODIFIED ALUMINUM NITRIDE RAW MATERIAL, MANUFACTURING METHOD OF ALUMINUM NITRIDE CRYSTALS, AND DOWNFALL DEFECT PREVENTION METHOD
#8 | 2023-05-25METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR SUBSTRATE, AND METHOD FOR SUPPRESSING INTRODUCTION OF DISPLACEMENT TO GROWTH LAYER
#9 | 2019-05-09Method for producing SiC substrate provided with graphene precursor and method for surface treating SiC substrate
6045493 ⎘