Hiroyuki Sada

City:

Beppu

Country:

Japan

Published Applications:

Last publication date:

2026-02-05

Top Assignees for applications by Hiroyuki Sada

The entities that hold a legal rights for patent applications filed by inventor Sada Hiroyuki:

Hiroyuki Sada from Beppu, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

DIE ATTACH FILM INDIVIDUALIZATION BEFORE WAFER DICING

Integrated circuit backside metallization

Integrated circuit backside metallization

Front side laser-based wafer dicing

Semiconductor die singulation

Die matrix expander with partitioned subring

InventorID:

6045797 ⎘