Simon Reiss

City:

Munich

Country:

Germany

Published Applications:

Last publication date:

2021-05-20

Top Assignees for applications by Simon Reiss

The entities that hold a legal rights for patent applications filed by inventor Reiss Simon:

Simon Reiss from Munich, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

Flat no-leads package, packaged electronic component, printed circuit board and measurement device

InventorID:

6046748 ⎘