Yuichi Ishida

City:

Chofu

Country:

Japan

Published Applications:

Last publication date:

2020-05-14

Top Assignees for applications by Yuichi Ishida

The entities that hold a legal rights for patent applications filed by inventor Ishida Yuichi:

KANEKA CORPORATION 3 Osaka, Japan
JAPAN AEROSPACE EXPLORATION AGENCY 2 Chofu-shi, Tokyo, Japan
Kaneka Corporation 1 Osaka-Shi, Japan
Japan Aerospace Exploration Agency 1 Chofu-shi, Japan
JAPAN AEROSPACE EXPLORATION AGENCY 1 Chofu, Japan
Kaneka Corporation 1 Osaka-shi, Osaka, Japan
Japan Aerospace Exporation Agency 1 Tokyo, Japan
JAPAN AEROSPACE EXPLORATION AGENCY 1 Tokyo, Japan

Recent patent applications by Ishida Yuichi

Yuichi Ishida from Chofu, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2020-05-14

US20200148846A1

Chemistry; metallurgy

Semipreg, prepreg, resin composite material, and production methods thereof

#2 | 2014-01-09

US20140011950A1

Chemistry; metallurgy

Resin-transfer-moldable terminal-modified imide oligomer using 2-phenyl-4,4′diaminodiphenyl ether and having excellent moldability, mixture thereof, varnish containing same, and cured resin thereof and fiber-reinforced cured resin thereof made by resin transfer molding and having excellent heat resistance

#3 | 2011-07-07

US20110165809A1

Chemistry; metallurgy

Soluble terminally modified imide oligomer using 2-phenyl-4, 4′-diaminodiphenyl ether, varnish, cured product thereof, imide prepreg thereof, and fiber-reinforced laminate having excellent heat resistance

InventorID:

6064207 ⎘