Chen-Hsiao Wang

City:

Hsinchu

Country:

Taiwan

Published Applications:

Last publication date:

2024-04-18

Top Assignees for applications by Chen-Hsiao Wang

The entities that hold a legal rights for patent applications filed by inventor Wang Chen-Hsiao:

Chen-Hsiao Wang from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

QFN PACKAGE AND FABRICATING METHOD OF THE SAME

COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Surface acoustic wave device fabrication method

Semiconductor device package structure and method for fabricating the same

Semiconductor chip

Semiconductor structure with UBM layer and method of fabricating the same

InventorID:

6064652 ⎘