Ryoichi Uchimura

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2024-05-30

Top Assignees for applications by Ryoichi Uchimura

The entities that hold a legal rights for patent applications filed by inventor Uchimura Ryoichi:

Ryoichi Uchimura from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

LAMINATE, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFACTURING LAMINATE

Laminate, printed wiring board, semiconductor package, and method for manufacturing laminate

Metal-clad laminate, printed wiring board and semiconductor package

Printed wiring board and semiconductor package

InventorID:

6064801 ⎘