Beijing
China
11
2026-06-04
The entities that hold a legal rights for patent applications filed by inventor DAI Jin:
Jin DAI from Beijing, CN has applied for patents for these inventions. The list has both pending applications and granted patents:
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC APPARATUS
#2 | 2026-05-21TRANSISTOR, 3D STACKED SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE
#3 | 2025-12-25MEMORY CELL, NAND STRING, MEMORY CELL ARRAY, DATA READING METHOD, AND DATA WRITING METHOD
#4 | 2025-04-03CXL MEMORY MODULE AND CONTROLLER, METHOD FOR ACCESSING DATA, AND STORAGE SYSTEM
#5 | 2025-02-13Semiconductor device, manufacturing method therefor, and electronic device
#6 | 2025-02-063D STACKED SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC EQUIPMENT
#7 | 2024-09-19CXL memory module, memory data swap method and computer system
#8 | 2024-04-18TRANSISTOR, 3D MEMORY AND MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE
#9 | 2024-02-22Method for efficiently processing instructions in a computational storage device
#10 | 2023-11-21Memory cell, 3D memory and preparation method therefor, and electronic device
#11 | 2023-11-21Object computational storage system, data processing method, client and storage medium
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