Sudipto Roy

City:

Spring Grove

Country:

Singapore

Published Applications:

Last publication date:

2005-05-26

Top Assignees for applications by Sudipto Roy

The entities that hold a legal rights for patent applications filed by inventor Roy Sudipto:

Sudipto Roy from Spring Grove, SG has applied for patents for these inventions. The list has both pending applications and granted patents:

Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding

Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding

Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding

InventorID:

6078913 ⎘