Erwin R. Estepa

City:

Baguio

Country:

Philippines

Published Applications:

Last publication date:

2005-04-07

Top Assignees for applications by Erwin R. Estepa

The entities that hold a legal rights for patent applications filed by inventor Estepa Erwin R.:

Erwin R. Estepa from Baguio, PH has applied for patents for these inventions. The list has both pending applications and granted patents:

Low cost substrate for an integrated circuit device with bondpads free of plated gold

InventorID:

6079048 ⎘