Hiroshi Ando

City:

Akashi

Country:

Japan

Published Applications:

Last publication date:

2007-03-22

Top Assignees for applications by Hiroshi Ando

The entities that hold a legal rights for patent applications filed by inventor Ando Hiroshi:

KANEKA CORPORATION 6 Osaka, Japan

Recent patent applications by Ando Hiroshi

Hiroshi Ando from Akashi, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2007-03-22

US20070066699A1

Chemistry; metallurgy

Photocuring resin composition containing organic polymer having epoxy group and/or oxetane group-containing silicon group at end, and method for producing same

#2 | 2006-11-23

US20060264545A1

Chemistry; metallurgy

One-part curable composition

#3 | 2006-11-09

US20060252903A1

Chemistry; metallurgy

Curing composition

#4 | 2006-10-03

US10482872

Curable composition

#5 | 2005-10-13

US20050228159A1

Chemistry; metallurgy

Organic polymer having epoxy-and/or oxetanyl-containing silicon group at the end and process for producing the same

#6 | 2005-08-04

US20050171315A1

Chemistry; metallurgy

Curable composition

InventorID:

6085931 ⎘