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Inventor profile of:

Taisuke Hirooka

City:

Kobe

Country:

Japan

Published Applications:

9

Last publication date:

2011-09-29

Top Assignees for applications by Taisuke Hirooka

The entities that hold a legal rights for patent applications filed by inventor Hirooka Taisuke:

  • NEOMAX CO., LTD. 7 Osaka, Japan
  • HITACHI METALS, LTD. 3 TOKYO, Japan

Recent patent applications by Hirooka Taisuke

Taisuke Hirooka from Kobe, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2011-09-29
US20110237078A1
Electricity

SiC substrate and method of manufacturing the same

#2 | 2008-04-08
US10426753
-

Method for producing alignment mark

#3 | 2007-04-10
US10433376
-

Substrate for thin-film magnetic head and method of manufacturing the substrate

#4 | 2006-12-14
US20060279879A1
Physics

Thin film magnetic head wafer with identification information

#5 | 2006-10-03
US10460371
-

Method for manufacturing a thin-film magnetic head wafer

#6 | 2005-08-02
US10211568
-

Method of recording identifier and set of photomasks

#7 | 2005-06-14
US10444133
-

Method of marking sintered body and method for manufacturing magnetic head wafer

#8 | 2005-05-26
US20050109729A1
Physics

Method of marking sintered body and method for manufacturing magnetic head wafer

#9 | 2005-05-24
US10229038
-

Method of recording identifier and set of photomasks

InventorID:

6099463 ⎘

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