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Inventor profile of:

Hiroichi Ukei

City:

Ibaraki

Country:

Japan

Published Applications:

7

Last publication date:

2018-11-15

Top Assignees for applications by Hiroichi Ukei

The entities that hold a legal rights for patent applications filed by inventor Ukei Hiroichi:

NITTO DENKO CORPORATION 4 Osaka, Japan
NITTO DENKO CORPORATION 3 Ibaraki-shi, Osaka, Japan
NITTO DENKO CORPORATION 3 Ibaraki-shi, Japan
NITTO DENKO CORPORATION 1 Ibaraki, Japan

Recent patent applications by Ukei Hiroichi

Hiroichi Ukei from Ibaraki, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2018-11-15

US20180332742A1

Electromagnetic wave absorber and molded article equipped with electromagnetic wave absorber

#2 | 2018-11-08

US20180319138A1

Performing operations; transporting

Electromagnetic wave absorber

#3 | 2009-11-05

US20090274858A1

Chemistry; metallurgy

Pressure-sensitive adhesive sheet with release liner

#4 | 2008-09-11

US20080220196A1

Performing operations; transporting

Pressure-sensitive adhesive sheet with release liner

#5 | 2008-04-03

US20080081143A1

Chemistry; metallurgy

Pressure-sensitive adhesive sheet with release liner

#6 | 2006-01-26

US20060019069A1

Chemistry; metallurgy

Pressure-sensitive adhesive tape

#7 | 2005-01-13

US20050006818A1

Performing operations; transporting

Base material for pressure-sensitive adhesive tape or sheet, pressure-sensitive tape or sheet using the base material, and process of producing the base material

InventorID:

6105785 ⎘