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Inventor profile of:

Toyohiro Aoki

City:

Yasu

Country:

Japan

Published Applications:

1

Last publication date:

2006-08-24

Top Assignees for applications by Toyohiro Aoki

The entities that hold a legal rights for patent applications filed by inventor Aoki Toyohiro:

INTERNATIONAL BUSINESS MACHINES CORPORATION 1 ARMONK, NY United States

Recent patent applications by Aoki Toyohiro

Toyohiro Aoki from Yasu, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2006-08-24

US20060189007A1

Wirebond crack sensor for low-k die

InventorID:

6108550 ⎘