Jeng-Dar Ko

City:

Pade

Country:

Taiwan

Published Applications:

Last publication date:

2015-12-17

Top Assignees for applications by Jeng-Dar Ko

The entities that hold a legal rights for patent applications filed by inventor Ko Jeng-Dar:

Jeng-Dar Ko from Pade, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

Electrically stackable semiconductor wafer and chip packages

Wafer leveled chip packaging structure and method thereof

Wafer-leveled chip packaging structure and method thereof

Electronic device package and method of manufacturing the same

Semiconductor package device

Wafer-leveled chip packaging structure and method thereof

Electronic device package and method of manufacturing the same

Wafer-leveled chip packaging structure and method thereof

InventorID:

6115276 ⎘