Hiroshi Miyazaki

City:

Beppu

Country:

Japan

Published Applications:

Last publication date:

2013-11-28

Top Assignees for applications by Hiroshi Miyazaki

The entities that hold a legal rights for patent applications filed by inventor Miyazaki Hiroshi:

Hiroshi Miyazaki from Beppu, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Multiple contact test probe

Solder ball pad structure

InventorID:

6115281 ⎘