Gianluca Rogiani

City:

Milan

Country:

Italy

Published Applications:

Last publication date:

2006-12-28

Top Assignees for applications by Gianluca Rogiani

The entities that hold a legal rights for patent applications filed by inventor Rogiani Gianluca:

Gianluca Rogiani from Milan, IT has applied for patents for these inventions. The list has both pending applications and granted patents:

Coaxial via structure for optimizing signal transmission in multiple layer electronic device carriers

Coaxial via structure for optimizing signal transmission in multiple layer electronic device carriers

Structure of stacked vias in multiple layer electrode device carriers

InventorID:

6118922 ⎘