Hideki Ito

City:

Daito

Country:

Japan

Published Applications:

Last publication date:

2006-10-05

Top Assignees for applications by Hideki Ito

The entities that hold a legal rights for patent applications filed by inventor Ito Hideki:

Hideki Ito from Daito, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Electronic component mounting package and package assembled substrate

InventorID:

6128376 ⎘