Hirofumi Hansei

City:

Buzen

Country:

Japan

Published Applications:

Last publication date:

2005-09-22

Top Assignees for applications by Hirofumi Hansei

The entities that hold a legal rights for patent applications filed by inventor Hansei Hirofumi:

Kabushiki Kaisha Toshiba 1 Tokyo, Japan

Recent patent applications by Hansei Hirofumi

Hirofumi Hansei from Buzen, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2005-09-22

US20050208690A1

Performing operations; transporting

Method of manufacturing optical semiconductor device, package molding jig, method of manufacturing package molding jig and manufacturing apparatus for package molding jig

InventorID:

6130874 ⎘