Jatinder Kumar

City:

Jalandhar

Country:

India

Published Applications:

Last publication date:

2012-12-06

Top Assignees for applications by Jatinder Kumar

The entities that hold a legal rights for patent applications filed by inventor Kumar Jatinder:

Jatinder Kumar from Jalandhar, IN has applied for patents for these inventions. The list has both pending applications and granted patents:

Electronic device including a packaging substrate having a trench

Process of forming an electronic device including removing a conductive member to form a trench and electrically isolate leads

Method of manufacturing a semiconductor component with a low cost leadframe using a non-metallic base structure

Semiconductor package structure and method of manufacture

InventorID:

6132563 ⎘