Ichinomiya
Japan
43
2012-04-26
The entities that hold a legal rights for patent applications filed by inventor Usui Ryosuke:
Ryosuke Usui from Ichinomiya, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
Element mounting substrate and semiconductor module
#2 | 2011-08-04Semiconductor module and portable apparatus provided with semiconductor module
#3 | 2010-06-10Method of manufacturing the circuit apparatus, method of manufacturing the circuit board, and method of manufacturing the circuit device
#4 | 2010-05-06Semiconductor module including circuit component and dielectric film, manufacturing method thereof, and application thereof
#5 | 2010-04-15Circuit board and method for manufacturing the same
#6 | 2009-05-07Device mounting board, semiconductor module, and mobile device
#7 | 2008-12-18Manufacturing method for semiconductor device containing stacked semiconductor chips
#8 | 2008-12-04Circuit device and manufacturing method therefor
#9 | 2008-09-11Semiconductor module, method of manufacturing semiconductor module, and mobile device
#10 | 2008-08-28Circuit device, a method for manufacturing a circuit device, and a semiconductor module
#11 | 2008-08-21Semiconductor module, portable device and method for manufacturing semiconductor module
#12 | 2008-07-03Packing board for electronic device, packing board manufacturing method, semiconductor module, semiconductor module manufacturing method, and mobile device
#13 | 2008-06-12Packaging board and manufacturing method therefor, semiconductor module and mobile apparatus
#14 | 2008-06-05Semiconductor module, method for manufacturing semiconductor modules and mobile device
#15 | 2008-03-13Packaging board, semiconductor module, and portable apparatus
#16 | 2007-11-27Semiconductor device, method for manufacturing same and thin plate interconnect line member
#17 | 2007-11-01Circuit apparatus and method of fabricating the apparatus
#18 | 2007-10-04Circuit device
#19 | 2007-08-30Circuit board and method for manufacturing the same
#20 | 2007-07-19Circuit device
#21 | 2007-05-29Semiconductor device having element isolation trench and method of fabricating the same
#22 | 2007-04-12Circuit board
#23 | 2007-04-05Circuit board and method of manufacturing circuit board
#24 | 2007-03-06Semiconductor device with shield
#25 | 2007-03-01Circuit board and circuit apparatus using the same
#26 | 2007-02-01Circuit board and circuit apparatus using the same
#27 | 2006-10-05Circuit device
#28 | 2006-09-14Circuit device
#29 | 2006-07-20Semiconductor module including circuit component and dielectric film, manufacturing method thereof, and application thereof
#30 | 2006-06-22Circuit device with circuit board and semiconductor chip mounted thereon
#31 | 2006-03-09Integrated antenna type circuit apparatus
#32 | 2006-03-02Semiconductor device having laminated structure
#33 | 2006-02-07Semiconductor device and method of fabricating the same
#34 | 2005-12-29Circuit apparatus provided with asperities on substrate surface
#35 | 2005-12-22Device mounting board and semiconductor apparatus using the same
#36 | 2005-12-08Semiconductor module with high process accuracy, manufacturing method thereof, and semiconductor device therewith
#37 | 2005-12-01Wiring substrate and method of fabricating the same
#38 | 2005-09-29Resin-sealed semiconductor device and method of manufacturing the same
#39 | 2005-09-29Semiconductor apparatus and method of fabricating the apparatus
#40 | 2005-09-22Manufacturing method for semiconductor device and determination method for position of semiconductor element
#41 | 2005-09-22Semiconductor apparatus
#42 | 2005-09-22Circuit device and manufacturing method thereof
#43 | 2005-03-31Semiconductor device containing stacked semiconductor chips and manufacturing method thereof
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