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Inventor profile of:

Ekta Misra

City:

Fishkill, New York

Country:

United States

Published Applications:

Last publication date:

2015-11-12

Top Assignees for applications by Ekta Misra

The entities that hold a legal rights for patent applications filed by inventor Misra Ekta:

INTERNATIONAL BUSINESS MACHINES CORPORATION 11 ARMONK, NY United States
GLOBALFOUNDRIES Inc. 2 Grand Cayman, Cayman Islands
Intetnational Business Machines Corporation 1 Armonk, NY United States

Recent patent applications by Misra Ekta

Ekta Misra from Fishkill, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2015-11-12

US20150325540A1

Electricity

PLUG VIA FORMATION BY PATTERNED PLATING AND POLISHING

#2 | 2015-04-09

US20150097283A1

Electricity

Plug via formation with grid features in the passivation layer

#3 | 2015-03-19

US20150076688A1

Electricity

Plug via formation by patterned plating and polishing

#4 | 2014-10-30

US20140319522A1

Electricity

Far back end of the line metallization method and structures

#5 | 2013-12-05

US20130320528A1

Electricity

Coaxial solder bump support structure

#6 | 2013-09-12

US20130234329A1

Electricity

Structures and methods to reduce maximum current density in a solder ball

#7 | 2013-06-06

US20130140695A1

Electricity

Solder bump connections

#8 | 2013-01-31

US20130026624A1

Electricity

Coaxial solder bump support structure

#9 | 2012-06-14

US20120146212A1

Electricity

Solder bump connections

#10 | 2012-06-07

US20120139123A1

Physics

Offset solder vias, methods of manufacturing and design structures

#11 | 2011-12-08

US20110298095A1

Electricity

Passivation layer extension to chip edge

#12 | 2011-06-23

US20110147922A1

Electricity

Structures and methods to reduce maximum current density in a solder ball

InventorID:

61360 ⎘