Chang Sup RYU

City:

Gyeonggi-do

Country:

Korea (South)

Published Applications:

Last publication date:

2013-01-31

Top Assignees for applications by Chang Sup RYU

The entities that hold a legal rights for patent applications filed by inventor RYU Chang Sup:

Chang Sup RYU from Gyeonggi-do, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

METHOD FOR FORMING BUMPS AND SUBSTRATE INCLUDING THE BUMPS

Solder bonding structure using bridge type pattern

InventorID:

61365 ⎘