Bin-Wei Lee

City:

Taipei

Country:

Taiwan

Published Applications:

Last publication date:

2006-11-16

Top Assignees for applications by Bin-Wei Lee

The entities that hold a legal rights for patent applications filed by inventor Lee Bin-Wei:

Bin-Wei Lee from Taipei, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

Printed circuit board structure and manufacturing method thereof

Chip heat dissipation structure and manufacturing method

InventorID:

6136544 ⎘