Michael G. Lee

City:

Saratoga, California

Country:

United States

Published Applications:

Last publication date:

2014-05-29

Top Assignees for applications by Michael G. Lee

The entities that hold a legal rights for patent applications filed by inventor Lee Michael G.:

Michael G. Lee from Saratoga, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Method and system for controlling chip warpage during bonding

Method and system for controlling chip inclination during flip-chip mounting

Hybrid interconnect technology

SYSTEMS AND METHODS FOR REINFORCING CHIP PACKAGES

InventorID:

61372 ⎘