Efren M. Lacap

City:

Hayward, California

Country:

United States

Published Applications:

Last publication date:

2013-01-31

Top Assignees for applications by Efren M. Lacap

The entities that hold a legal rights for patent applications filed by inventor Lacap Efren M.:

Efren M. Lacap from Hayward, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Wafer-level chip scale package

Wafer-level chip scale package

Wafer-level chip scale package

InventorID:

61383 ⎘