Chino
Japan
45
2022-04-14
The entities that hold a legal rights for patent applications filed by inventor ITO Haruki:
Haruki ITO from Chino, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, CIRCUIT SUBSTRATE, AND ELECTRONIC APPARATUS
#2 | 2020-11-12Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
#3 | 2020-02-27Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
#4 | 2020-01-02Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
#5 | 2019-09-26Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
#6 | 2019-02-07Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
#7 | 2018-10-18Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
#8 | 2018-10-18Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
#9 | 2018-10-18Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
#10 | 2015-12-24Physical quantity sensor, electronic device, altimeter, electronic apparatus, and mobile object
#11 | 2015-10-29Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus
#12 | 2015-10-01Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipment
#13 | 2015-02-12SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, CIRCUIT SUBSTRATE, AND ELECTRONIC APPARATUS
#14 | 2014-12-11Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus
#15 | 2014-05-15Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
#16 | 2013-10-10Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus
#17 | 2013-04-25SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, CIRCUIT SUBSTRATE, ELECTRO-OPTICAL APPARATUS, AND ELECTRONIC EQUIPMENT
#18 | 2013-01-31Manufacturing method for semiconductor device
#19 | 2012-10-18Sealed electric element package
#20 | 2011-11-03Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
#21 | 2011-09-29Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus
#22 | 2011-03-17Interconnection of land section to wiring layers at center of external connection terminals in semiconductor device and manufacturing thereof
#23 | 2011-01-27Electronic device, method of producing the same, and semiconductor device
#24 | 2010-11-25SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, CIRCUIT SUBSTRATE, ELECTRO-OPTICAL APPARATUS, AND ELECTRONIC EQUIPMENT
#25 | 2010-10-07Semiconductor device, circuit substrate, electro-optic device and electronic appliance
#26 | 2010-06-03Sealed surface acoustic wave element package
#27 | 2010-01-28Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus
#28 | 2009-02-05Electronic device, method of producing the same, and semiconductor device
#29 | 2009-01-29Manufacturing method for interconnection having stress-absorbing layer between the semiconductor substrate and the external connection terminal
#30 | 2008-10-23Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus
#31 | 2008-01-17Semiconductor device, circuit substrate, electro-optic device and electronic appliance
#32 | 2006-12-28Method of manufacturing semiconductor device
#33 | 2006-12-14Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
#34 | 2006-11-23Electronic substrate manufacturing method, semiconductor device manufacturing method, and electronic equipment manufacturing method
#35 | 2006-11-23Test probe and manufacturing method for test probe
#36 | 2006-11-14Semiconductor device and method of manufacturing the same, semiconductor wafer, circuit board and electronic instrument
#37 | 2006-11-02Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipment
#38 | 2006-10-26Method of manufacturing multi-layered substrate
#39 | 2006-08-29Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipment
#40 | 2006-06-22Semiconductor device, method for manufacturing semiconductor device, circuit board, and electronic instrument
#41 | 2006-03-16Sealed surface acoustic wave element package
#42 | 2006-03-09Test probe and tester, method for manufacturing the test probe
#43 | 2005-12-15Semiconductor device, circuit substrate, electro-optic device and electronic appliance
#44 | 2005-09-06Semiconductor device and method of manufacture thereof, circuit board, and electronic instrument
#45 | 2005-02-08Semiconductor device and manufacturing method therefor, circuit board, and electronic equipment
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