Morgan Hill, California
United States
2
2013-11-07
The entities that hold a legal rights for patent applications filed by inventor Harper Peter R.:
Peter R. Harper from Morgan Hill, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Method of forming an integrated circuit package including a direct connect pad, a blind via, and a bond pad electrically coupled to the direct connect pad
#2 | 2013-01-31Integrated circuit package including a direct connect pad, a blind via, and a bond pad electrically coupled to the direct connect pad
61395 ⎘