Hideki Tanaka

City:

Ohtsu

Country:

Japan

Published Applications:

Last publication date:

2006-04-18

Top Assignees for applications by Hideki Tanaka

The entities that hold a legal rights for patent applications filed by inventor Tanaka Hideki:

TOYO BOSEKI KABUSHIKI KAISHA 2 Osaka, Japan

Recent patent applications by Tanaka Hideki

Hideki Tanaka from Ohtsu, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2006-04-18

US10188223

Aqueous resin composition, aqueous coating material containing the composition, coating provided by the material, and metal plate coated with the material

#2 | 2005-08-11

US20050176873A1

Chemistry; metallurgy

Aqueous resin composition, aqueous coating material containing the composition, coating provided by the material, and metal plate coated with the material

InventorID:

6140761 ⎘