Koichi Ikeshima

City:

Okazaki

Country:

Japan

Published Applications:

Last publication date:

2010-05-25

Top Assignees for applications by Koichi Ikeshima

The entities that hold a legal rights for patent applications filed by inventor Ikeshima Koichi:

Koichi Ikeshima from Okazaki, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Assembling method using marked information and assembly assembled by said assembling method

Thin-walled honeycomb structure and method for reinforcing the same

Assembly method using marked information and assembly assembled by said assembling method

Ceramic honeycomb structure

InventorID:

6142799 ⎘