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Inventor profile of:

Jun Horikoshi

City:

Annaka

Country:

Japan

Published Applications:

8

Last publication date:

2018-01-11

Top Assignees for applications by Jun Horikoshi

The entities that hold a legal rights for patent applications filed by inventor Horikoshi Jun:

  • SHIN-ETSU CHEMICAL CO., LTD 8 Tokyo, Japan
  • Shin-Etsu Chemical Co., Ltd. 1 Chiyoda-ku, Japan

Recent patent applications by Horikoshi Jun

Jun Horikoshi from Annaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2018-01-11
US20180011397A1
Physics

Adhesive for pellicle, pellicle, and method of selecting adhesive for pellicle

#2 | 2016-08-11
US20160230056A1
Chemistry; metallurgy

Agglutinant for pellicle and a pellicle using it

#3 | 2016-06-30
US20160187771A1
Physics

Agglutinat for pellicle, a pellicle using it and a method for evaluating pellicle

#4 | 2015-10-08
US20150286134A1
Physics

Agglutinant for pellicle and a pellicle including the same

#5 | 2015-10-08
US20150286133A1
Physics

Pellicle for lithography

#6 | 2015-03-26
US20150085265A1
Physics

Pellicle

#7 | 2011-05-05
US20110104420A1
Physics

Pellicle and a method for making the same

#8 | 2006-11-16
US20060257672A1
Electricity

RTV silicone rubber composition for electric and electronic part protection, circuit boards, silver electrodes, and silver chip resistors

InventorID:

6157741 ⎘

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