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Inventor profile of:

Eui-chul Kang

City:

Tsukuba

Country:

Japan

Published Applications:

Last publication date:

2018-07-05

Top Assignees for applications by Eui-chul Kang

The entities that hold a legal rights for patent applications filed by inventor Kang Eui-chul:

NOF CORPORATION 11 Tokyo, Japan
OSAKA UNIVERSITY 1 Osaka, Japan
TOHOKU TECHNO ARCH CO., LTD. 1 Sendai-si, Miyagi, Japan
OSAKA UNIVERSITY 1 Suita-shi, Osaka, Japan
NOF CORPORATION 1 Shibuya-ku, Tokyo, Japan
TOHOKU TECHNO ARCH CO., LTD. 1 Sendai-shi, Miyagi, Japan

Recent patent applications by Kang Eui-chul

Eui-chul Kang from Tsukuba, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2018-07-05

US20180186931A1

Chemistry; metallurgy

Hetero type monodispersed polyethylene glycol, intermediate for production of hetero type monodispersed polyethylene glycol, methods for producing same, and hetero type monodispersed polyethylene glycol conjugate

#2 | 2015-07-23

US20150206618A1

Electricity

Silver nanoparticles, method for producing same, silver nanoparticle dispersion liquid, and base provided with silver material

#3 | 2015-07-23

US20150203699A1

Chemistry; metallurgy

Silver-containing composition, and base for use in formation of silver element

#4 | 2014-10-16

US20140305684A1

Chemistry; metallurgy

Composition for forming copper pattern and method for forming copper pattern

#5 | 2010-04-01

US20100081780A1

Chemistry; metallurgy

Diol (meth) acrylate compound having urethane bond, method for producing the same, and polymer thereof

#6 | 2010-04-01

US20100081779A1

Chemistry; metallurgy

Diol (meth) acrylate compound having urethane bond, method for producing the same, and polymer thereof

#7 | 2009-10-01

US20090247718A1

Chemistry; metallurgy

Diol (meth) acrylate compound having urethane bond, method for producing the same, and polymer thereof

#8 | 2009-09-24

US20090240015A1

Chemistry; metallurgy

Diol (meth) acrylate compound having urethane bond, method for producing the same, and polymer thereof

#9 | 2009-08-20

US20090208719A1

Chemistry; metallurgy

Inorganic-organic hybrid composition and use thereof

#10 | 2006-05-09

US10810305

Polyethylene glycol-modified semiconductor nanoparticles, method for producing the same, and material for biological diagnosis

#11 | 2006-04-27

US20060089473A1

Chemistry; metallurgy

Diol (meth) acrylate compound having urethane bond, method for producing the same, and polymer thereof

InventorID:

6158304 ⎘