Ibaraki
Japan
5
2014-03-06
The entities that hold a legal rights for patent applications filed by inventor Uenda Daisuke:
Daisuke Uenda from Ibaraki, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
Thermosetting resin sheet for sealing electronic component, resin-sealed type semiconductor device, and method for producing resin-sealed type semiconductor device
#2 | 2012-05-24Film for the backside of flip-chip type semiconductor, dicing tape-integrated film for the backside of semiconductor, method of manufacturing film for the backside of flip-chip type semiconductor, and semiconductor device
#3 | 2006-06-29Cleaning substrate of substrate processing equipment and heat resistant resin preferable therefor
#4 | 2005-11-03Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using them
#5 | 2005-05-10Method of manufacturing double-sided circuit board
6161326 ⎘