Ichihara
Japan
3
2010-01-07
The entities that hold a legal rights for patent applications filed by inventor Ookubo Keisuke:
Keisuke Ookubo from Ichihara, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
Adhesive bonding sheet, semiconductor device using the same, and method for manufacturing such semiconductor device
#2 | 2010-01-07Adhesive bonding sheet, semiconductor device using same, and method for manufacturing such semiconductor device
#3 | 2007-10-18Adhesive bonding sheet, semiconductor device using the same, and method for manufacturing such semiconductor device
6161835 ⎘