Jun Harada

City:

Yasu

Country:

Japan

Published Applications:

Last publication date:

2010-06-03

Top Assignees for applications by Jun Harada

The entities that hold a legal rights for patent applications filed by inventor Harada Jun:

Jun Harada from Yasu, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Composite electronic component

Method of manufacturing composite electronic component

Composite electronic component

Electronic component including a shielding metal film disposed on a resin layer

Ceramic multilayer substrate

InventorID:

6164392 ⎘