Michael Hsing

City:

Sanchong

Country:

Taiwan

Published Applications:

Last publication date:

2008-03-20

Top Assignees for applications by Michael Hsing

The entities that hold a legal rights for patent applications filed by inventor Hsing Michael:

Michael Hsing from Sanchong, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

Support with recessed electrically conductive chip attachment material for flip-chip bonding a light emitting chip

InventorID:

6171420 ⎘