Koji Tanaka

City:

Echizen

Country:

Japan

Published Applications:

Last publication date:

2009-02-26

Top Assignees for applications by Koji Tanaka

The entities that hold a legal rights for patent applications filed by inventor Tanaka Koji:

Koji Tanaka from Echizen, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Covered multilayer module

Wiring board and wiring board module

InventorID:

6175515 ⎘