Toru Baba

City:

Osaka

Country:

Japan

Published Applications:

Last publication date:

2009-10-29

Top Assignees for applications by Toru Baba

The entities that hold a legal rights for patent applications filed by inventor Baba Toru:

Toru Baba from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Wafer level package structure, and sensor device obtained from the same package structure

Sensor device and production method therefor

Wafer level package structure and production method therefor

Sensor device and production method therefor

Method and apparatus for modifying object with electrons generated from cold cathode electron emitter

InventorID:

6177986 ⎘