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Inventor profile of:

Hisayasu Kaneshiro

City:

Uji

Country:

Japan

Published Applications:

Last publication date:

2011-02-10

Top Assignees for applications by Hisayasu Kaneshiro

The entities that hold a legal rights for patent applications filed by inventor Kaneshiro Hisayasu:

KANEKA CORPORATION 10 Osaka, Japan
Kaneka Corporation 1 Osaka-Shi, Japan
Kaneka Corporation 1 Osaki-Shi, Osaka, Japan

Recent patent applications by Kaneshiro Hisayasu

Hisayasu Kaneshiro from Uji, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2011-02-10

US20110033682A1

Electricity

Multilayer polyimide film, laminate, and metal-clad laminate

#2 | 2009-08-06

US20090197110A1

Performing operations; transporting

Polyimide film and adhesive film and flexible metal-clad laminate both obtained with the same

#3 | 2008-12-11

US20080305346A1

Electricity

Adhesive film and use thereof

#4 | 2008-12-11

US20080305316A1

Electricity

Polyimide film and use thereof

#5 | 2008-11-20

US20080287642A1

Chemistry; metallurgy

Process for production of polyimide film having high adhesiveness

#6 | 2008-08-26

US10479543

Semiconductive polymide film and process for production thereof

#7 | 2008-07-31

US20080182112A1

Electricity

Metal-coated polyimide film

#8 | 2007-08-02

US20070179271A1

Chemistry; metallurgy

Polyimide film having high adhesiveness and method for producing same

#9 | 2007-07-12

US20070158869A1

Performing operations; transporting

Process for producing adhesive film

#10 | 2007-06-07

US20070129533A1

Chemistry; metallurgy

Polyimide film and process for producing the same

#11 | 2006-03-28

US10471047

Polyimide film for flexible printed board and flexible printed board using the same

InventorID:

6178663 ⎘