Eisuke Ogawa

City:

Kitakyushu-shi

Country:

Japan

Published Applications:

Last publication date:

2015-06-18

Top Assignees for applications by Eisuke Ogawa

The entities that hold a legal rights for patent applications filed by inventor Ogawa Eisuke:

HITACHI METALS, LTD. 2 TOKYO, Japan
NISSHIN STEEL CO., LTD. 1 Tokyo, Japan

Recent patent applications by Ogawa Eisuke

Eisuke Ogawa from Kitakyushu-shi, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2015-06-18

US20150167735A1

Mechanical engineering

Bearing

#2 | 2014-01-23

US20140020622A1

Chemistry; metallurgy

Roll for molten metal plating bath and method for manufacturing the same

InventorID:

618536 ⎘