Daisuke Hirokane

City:

Utsunomiya

Country:

Japan

Published Applications:

Last publication date:

2007-09-20

Top Assignees for applications by Daisuke Hirokane

The entities that hold a legal rights for patent applications filed by inventor Hirokane Daisuke:

SUMITOMO BAKELITE CO., LTD. 1 Tokyo, Japan
SUMITOMO BAKELITE CO., LTD. 1 Shinagawa-ku, Japan

Recent patent applications by Hirokane Daisuke

Daisuke Hirokane from Utsunomiya, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2007-09-20

US20070216040A1

Chemistry; metallurgy

Epoxy resin composition for the encapsulation of semiconductors and semiconductor devices

InventorID:

6186258 ⎘