Takako Ejiri

City:

Chikusei

Country:

Japan

Published Applications:

Last publication date:

2010-09-16

Top Assignees for applications by Takako Ejiri

The entities that hold a legal rights for patent applications filed by inventor Ejiri Takako:

Takako Ejiri from Chikusei, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Polyamide-imide resin, process for production of polyamide resin, and curable resin composition

Polyamideimide resin, adhesive agent, material for flexible substrate, flexible laminate, and flexible print wiring board

Adhesion assisting agent fitted metal foil, and printed wiring board using thereof

InventorID:

6188999 ⎘