Eagan, Minnesota
United States
54
2025-06-19
The entities that hold a legal rights for patent applications filed by inventor Kautzky Michael Christopher:
Michael Christopher Kautzky from Eagan, US has applied for patents for these inventions. The list has both pending applications and granted patents:
SINGLE-GRAIN NEAR-FIELD TRANSDUCER AND PROCESS FOR FORMING SAME
#2 | 2024-10-10THIN-FILM CRYSTALLINE STRUCTURE WITH SURFACES HAVING SELECTED PLANE ORIENTATIONS
#3 | 2024-06-06Single-grain near-field transducer and process for forming same
#4 | 2023-02-21Transfer-printed near-field transducer and heat sink
#5 | 2022-11-17Single-grain near-field transducer and process for forming same
#6 | 2022-02-17Thin-film crystalline structure with surfaces having selected plane orientations
#7 | 2021-11-23Thin-film crystalline structure with surfaces having selected plane orientations
#8 | 2019-07-11NFT with mechanically robust materials
#9 | 2018-09-13NFT with mechanically robust materials
#10 | 2017-08-31NFT with mechanically robust materials
#11 | 2016-12-01Thermally robust near-field transducer peg
#12 | 2016-02-02Waveguide cladding layer with transparent heat sink for heat-assisted magnetic recording device
#13 | 2015-11-26Near-field transducer peg encapsulation
#14 | 2015-09-10Near field transducer and heat sink design for heat assisted magnetic recording
#15 | 2015-07-30Laser mounted on edge of a slider
#16 | 2015-05-28Interlayer for device including NFT and cladding layers
#17 | 2015-05-07Recording head with piezoelectric contact sensor
#18 | 2015-04-30Near-field transducer with rounded or obtuse corners
#19 | 2015-02-12INTEGRATED TOOL FOR FABRICATING AN ELECTRONIC COMPONENT
#20 | 2014-12-25Near field transducer and heat sink design for heat assisted magnetic recording
#21 | 2014-12-25Near-field transducer peg encapsulation
#22 | 2014-09-18Heat assisted magnetic recording head having thermal sensor with high-TCR transparent conducting oxide
#23 | 2014-09-18Magnetoresistive element with nano-crystalline shield
#24 | 2014-09-11Encapsulated laser diode for heat-assisted magnetic recording
#25 | 2014-02-20Recording head including a near field transducer
#26 | 2014-02-20Recording head including NFT and heatsink
#27 | 2014-01-02Interlayer for device including NFT and cladding layers
#28 | 2013-12-26Recording head for heat assisted magnetic recording with diffusion barrier surrounding a near field transducer
#29 | 2013-12-12Layered near-field transducer
#30 | 2013-10-24Near field transducers including nitride materials
#31 | 2013-10-17Commonly-poled piezoelectric device
#32 | 2013-09-12HAMR NFT materials with improved thermal stability
#33 | 2013-08-20Layered near-field transducer
#34 | 2013-07-25ELECTRODEPOSITION METHODS
#35 | 2013-07-18Heat assisted magnetic recording (HAMR) heads including components made of nickel alloys
#36 | 2013-05-23Overcoats that include magnetic materials
#37 | 2013-03-21Recording head for heat assisted magnetic recording with diffusion barrier surrounding a near field transducer
#38 | 2013-01-31Commonly-poled piezoelectric device
#39 | 2012-10-25Magnetic element with enhanced coupling portion
#40 | 2012-10-25Write pole and shield with different taper angles
#41 | 2012-09-20Write pole fabricated using a carbon hard mask and method of making
#42 | 2012-09-04Heat assisted magnetic recording (HAMR) heads including components made of nickel alloys
#43 | 2012-06-28Heat-sinks for optical near-field transducers
#44 | 2012-06-07Optical waveguide clad material
#45 | 2012-02-23Recording head for heat assisted magnetic recording with diffusion barrier surrounding a near field transducer
#46 | 2011-08-25Optical waveguide clad material
#47 | 2011-08-25HAMR NFT materials with improved thermal stability
#48 | 2011-02-10Commonly-poled piezoelectric device
#49 | 2010-12-23Method for forming a magnetic writer
#50 | 2010-05-06Integrated Tool for Fabricating an Electronic Component
#51 | 2006-09-14Apparatus including a dielectric mirror and method of reflecting radiation away from a portion of an apparatus
#52 | 2006-09-05Negative thermal expansion dielectrics for thermal pole tip protrusion compensation
#53 | 2006-01-24Writer core structures having improved thermal dissipation properties
#54 | 2005-09-27Magnetic head having a heat dissipating structure
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