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Inventor profile of:

Hiroshi Okada

City:

Mooka

Country:

Japan

Published Applications:

1

Last publication date:

2007-03-29

Top Assignees for applications by Hiroshi Okada

The entities that hold a legal rights for patent applications filed by inventor Okada Hiroshi:

SENJU METAL INDUSTRY CO., LTD 1 Tokyo, Japan

Recent patent applications by Okada Hiroshi

Hiroshi Okada from Mooka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2007-03-29

US20070069379A1

Chemistry; metallurgy

Lead-free solder ball

InventorID:

6190557 ⎘