Echizen
Japan
26
2014-10-23
The entities that hold a legal rights for patent applications filed by inventor Takeuchi Shunsuke:
Shunsuke Takeuchi from Echizen, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
Multilayer electronic component and method for manufacturing the same
#2 | 2014-06-12Method for manufacturing multilayer electronic component
#3 | 2013-04-18Multilayer electronic component and method for manufacturing the same
#4 | 2012-07-19Method for manufacturing a multilayer ceramic electronic component
#5 | 2012-06-07Laminated electronic component and method for manufacturing the same
#6 | 2012-03-08Method for manufacturing laminated electronic component
#7 | 2011-07-07Method for manufacturing multilayer electronic component
#8 | 2010-12-30Laminated ceramic electronic component with directly plated external terminal electrodes and manufacturing method therefor
#9 | 2010-12-30Multilayer electronic component and method for manufacturing the same
#10 | 2010-12-02Laminated electronic component including water repellant and manufacturing method therefor
#11 | 2010-11-18Laminated electronic component and manufacturing method therefor
#12 | 2010-08-19Method for manufacturing multilayer electronic component
#13 | 2010-05-13Laminated ceramic electronic component
#14 | 2009-12-31Multilayer ceramic electronic component and method for making the same
#15 | 2009-12-10Monolithic ceramic electronic component and method of manufacturing monolithic ceramic electronic component
#16 | 2009-12-10Ceramic electronic component and method for manufacturing the same
#17 | 2009-11-26Laminated electronic component and method for manufacturing the same
#18 | 2009-11-26Laminated electronic component and method for manufacturing the same
#19 | 2009-11-12Monolithic ceramic electronic component and method for manufacturing the same
#20 | 2009-11-12Multilayer ceramic electronic component and method for manufacturing the same
#21 | 2009-10-29Multilayer ceramic electronic component including external electrodes that include a plating layer having a low film stress
#22 | 2009-10-29Ceramic electronic component and method for manufacturing the same
#23 | 2009-09-10Multilayer electronic component and method for manufacturing the same
#24 | 2009-06-25Multilayer ceramic electronic component and manufacturing method thereof
#25 | 2008-10-02Multilayer electronic component and method for manufacturing multilayer electronic component
#26 | 2008-09-04Multilayer electronic component including a counter diffusion layer
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