Koji Munakata

City:

Sakura

Country:

Japan

Published Applications:

Last publication date:

2015-12-03

Top Assignees for applications by Koji Munakata

The entities that hold a legal rights for patent applications filed by inventor Munakata Koji:

Koji Munakata from Sakura, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Component built-in board and method of manufacturing the same, and mounting body

Component built-in board and method of manufacturing the same, and mounting body

Wafer level chip scale package

Semiconductor device

InventorID:

6197232 ⎘