Ruben Madrid

City:

Cebu

Country:

Philippines

Published Applications:

Last publication date:

2008-08-07

Top Assignees for applications by Ruben Madrid

The entities that hold a legal rights for patent applications filed by inventor Madrid Ruben:

Ruben Madrid from Cebu, PH has applied for patents for these inventions. The list has both pending applications and granted patents:

Semiconductor die package including leadframe with die attach pad with folded edge

Carrier with metal bumps for semiconductor die packages

Carrier with metal bumps for semiconductor die packages

Method for making power chip scale package

InventorID:

6201971 ⎘