Shigeru Tanaka

City:

Settsu

Country:

Japan

Published Applications:

Last publication date:

2008-12-25

Top Assignees for applications by Shigeru Tanaka

The entities that hold a legal rights for patent applications filed by inventor Tanaka Shigeru:

KANEKA CORPORATION 4 Osaka, Japan
Kaneka Corporation 2 Osaka-Shi, Japan
Kaneka Corporation 1 Osaka-shi, Osaka, Japan

Recent patent applications by Tanaka Shigeru

Shigeru Tanaka from Settsu, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2008-12-25

US20080314618A1

Electricity

Solution, component for plating, insulating sheet, laminate, and printed circuit board

#2 | 2008-09-25

US20080230261A1

Electricity

Thermosetting resin composition and use thereof

#3 | 2007-11-15

US20070264490A1

Chemistry; metallurgy

Plating target material, polyamic solution and polyimide resin solution which are used to form the plating target material, and printed-wiring board using them

#4 | 2007-04-05

US20070074896A1

Performing operations; transporting

Thermosetting resin composition, laminated body using it, and circuit board

#5 | 2006-10-03

US10482897

Resin composition

#6 | 2006-06-01

US20060115670A1

Electricity

Thermoplastic polyimide resin film, multilayer body and method for manufacturing printed wiring board composed of same

InventorID:

6204570 ⎘